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PCA/L Platinum-chip Temperature Sensors

MOQ: 100PCS
All sizes available
Samle available

Quantity:
  • PAC/L style
  • JUMO
Description: 

Platinum-chip temperature sensors are based on a temperature-dependent resistance whose development and permissible tolerances are defined in the international standard EN 60751. They combine the favorable properties of a platinum temperature sensor with the advantages of large-scale production. Their distinctive features are standardization and universal interchangeability, as well as high measurement accuracy, excellent long- term stability and good reproducibility of the electrical properties. Furthermore, prices have fallen considerably in recent years, since these sensors are designed to meet large- quantity requirements. With regard to the price, platinum-chip temperature sensors are therefore a genuine alternative to thermistors, which are based on semiconductors.

Platinum-chip temperature sensors,L version, are mainly used in the fabrication of various probes with connecting cables. They are particularly suitable for electrical connection through soft-soldered joints. The connecting wires are made from pure silver and are ideal for this purpose.

The application temperature ranges from -70 to +250°C. However, the maximum temperature is +350°C, which opens up additional application possibilities.


Dimensional drawing:

薄膜铂电阻2-2


Technical Data

Standard

EN 60 751

Temperature coefficient

= 3.850 x 10-3 °C-1 (between 0 and 100°C)

Temperature range

-70 to +250°C (+350°C)

Tolerance  

Temperature validity range Class 1/3 DIN B:       -50 to +200°C

Temperature validity range Class A:       -70 to +300°C

Temperature validity range Class B:       -70 to +350°C

Measuring current/maximum current

Pt100 recommended: 1.0mA                     maximum: 7mA

Pt500 recommended: 0.7mA        maximum: 3mA

Pt1000 recommended: 0.1mA       maximum: 1mA

Pt5000 recommended: 0.1mA                   maximum: 1mA

Operating conditions

Platinum-chip temperature sensors may not be used unprotected in humid ambient conditions or corrosive atmospheres. They must also not be immersed directly in liquids. The user may have to carry out some checks before operation.

Connecting wires

These temperature sensors feature connecting wires that are made from pure silver. The connecting wires are especially suitable for soft-soldered joints. During further processing, it is essential to ensure that the connections are not subjected to lateral pressures. The horizontal tension on the individual connecting wire must not exceed the maximum value of 5N. Any unnecessary bending of the connecting wires must be avoided, as this may result in material fatigue and a wire break. Longer connecting wires up to 300mm length (in one piece) can optionally be fitted. Alternatively, extensions of any length or insulated stranded wires can, on request, be fitted at a later stage.

Measurement point

The nominal value specified refers to the standard connecting wire length L1. The measurement is acquired 2mm from the open end of the wire. If the wire length is altered, changes in resistance will occur which may result in the tolerance class not being met.

Long-term stability

max. R0 drift 0.05%/year

Low-temperature application

Taking into account nominal value drifts and hysteresis effects that may occur within  certain limits, temperature measurements down to -200°C are also possible. Further details can be obtained on request.

Insulation resistance

>10MΩ at room temperature

Self-heating

t= I2 x R x E

Packaging

Blister belt/bag

Storage

 In the standard belt packaging, JUMO temperature sensors, PCA/L style, can be stored   for at least 12 months under normal ambient conditions. It is not permissible to store the sensors in aggressive atmospheres, corrosive media, or in high humidiy. Since the connecting wires for this version are made from pure silver, storability is enhanced by air- tight packaging and dark surroundings. If this is not the case, the silver will tend to get tarnished with time, which may lead to difficulties when making the solder joint.


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